| Major Business
Partners |
 |
|
Hitachi Displays
Tokyo
Electron
Shin-etsu Semiconductor
Hitachi Ltd.
Mitsubishi
Electric
Teijin
Shin-etsu
Engineering | |
|
| Major Sales
Products |
|
| Related to Semiconductor |
Wafer Auto Demounting Machine |
|
Wafer Auto
Transfer Machine |
|
IC Package
Laser Marking System |
|
Laser Marking System for wafer |
|
|
| Related to Liquid Crystal |
Cleaning Equipment for pre-polarizer
Sticking |
|
Polarizer
Sticking Machine |
|
Terminal
Cleaner machine |
|
Auto
Dispenser |
|
Substrate
Stocker System |
|
ACF
Sticking Machine |
|
Substrate
Loader and Un-loader System |
|
LCD Cassette Transfer Equipment |
|
|
| Related to Braun-tube and
Electron-gun |
Laser Welding Equipment for Electric Pole
Devices |
|
Beading Automatic Assembler |
|
Parallel
Automatic Beading Machine |
|
Stem &
Lens Automatic Welding Machine |
|
S-ring
& Ribbon Automatic Welding Machine |
|
SC & BSC Automatic Welding Machine |
|
|
| Related to FA |
Micro Device Automatic Assembling System |
|
FA Robot
System |
|
Laser
Application System |
|
Resin
Products |
|
Air leakage
Tester for Bag components |
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Pin-hole Checker | |
|
| Laser Technical
Application System |
|
This is the automatic welding system of
micro devices used with YAG Laser.
The work transportation is
transferred with the fixed pitch of tool pallet by an ACservo
motor,and applied with the up and down return system.
The working
unit on each station is modulated, and easy
transferable. |
|
| LCD Cassette Auto
Transfer System |
|
|
This is the automatic transfer system of the
magazine cassette for liquid crystal panels.
The system is
operated automatically on transfer-out, transfer-in, and shutter
open/close at the entrance.
The transportation between each
provided facilities are adjustable on the factory layout, and is
also easily adjustable to the layout modifications. |
|
| Single Wafer
Transportation System |
|
|
This is the automatic transfer system of the wafer,
diameter 300mm from the loader side cassette to the un-loader side
cassette on the pre-set sequence.
This is able to select the
front/rear reversal, after the operation of the waferfs aliment
(center setting , notch setting) |
|
| Pick
Mounter |
|
|
This is the assembling system of the deferent type
components for printed circuit boards or others.
The supply
method is applicable with various systems such as a stick supply, a
sticky tape supply, an emboss carrier supply and tray supply.
The
assemble robot is used of the x-y-z perpendicularity
type. |
|
| Micro Components Auto
Assembling System |
|
|
This is the automatic assembling system used of the
perpendicularity robot.
The assembling tools are transferred on
the free flow conveyer.
The parts supply is used a parts feeder,
a pallet feeder. A stick feeder, or others. |
|
| Moving Module for
Robot |
|
|
This is the system developed as the moving module
for the multi-joint robot rink type robot.
The system is
constructed with 2 pieces of LM guide withstanding to the 100kg
moving weight and hardness which is mountable for a big size
robot. |
